Model Number

Mistral 360

Product Description

Forced air convection reflow oven

Product Feature

The M 360 convection reflow soldering system uses re-circulated hot air 
to accomplish reflow at much lower temperatures than IR systems. 
Using constant, even heating, a great variety of board sizes will reach reflow temperature 
with the same heat profile. 
By eliminating set-up time your production line can work to its fullest capacity. 
Convection heating provides other advantages over IR. In addition 
tot the wide process window, it works with:
• No shadowing
• No colour sensitivity
• No belt load sensitivity
• No hot spots
• No cold solder joints

With a belt width of 36 cm (over 14”) and consistent temperature 
across the entire width the oven can easily accommodate your entire production line 
with speed ups to 1.20 meters/minute.

User friendly with total control.
Full computer control of all aspects of the M 360 is compromised by complex programming 
sequences. The colour graphics system ensures swift operator training 
with simple menu driven commands. 
In most cases the operators are self-sufficient within minutes of their introduction 
to the system. The easy-to-use comprehensive program includes: 
4 zone temperature control
Full process monitoring
Built-in profiling

“Environment friendly” is more than just a catch phrase tot the M oven designers.
With reduced energy consumption and carefully controlled air-flow and exhaust systems, 
your plant will only benefit from its introduction. 
Ease of access to all parts of the machine ensures fast and easy maintenance. 
Managing information is quickly available and ancillary processes, such as glue curing, 
are easily programmed. 
The Mistral 360 reflow system is built to leas and to perform to the highest standards 
throughout its long lifetime. 

Main advances Mistral 360
• Forced air convection heat for maximum temperatures up to 300°C.
• Forced air convection provides uniform heating and prevents shadowing.
• Four heat zones, each independently controlled for accurate temperature profiles.
• Bench-top unit can be converted to a standalone unit by use of the optional cabinet 
and also integrated into a fully conveyorized production line.
• Output to printer, for print-out program data and temperature profiles.
• Full colour touch screen for easy programming with user friendly interface.
• Viewing panel allows visual inspection of reflow process.

Technical specifications 
• Power requirements: 220/380 VAC 3-phrase, other rating available.
• Rated power max.: 9400 W
• Thermocouples electronically monitored.
• Stainless steel spring wires conveyor belt.
• Conveyor speed: 10–120 cm/min. (4-48 inch/min.)
• Soldering temperatures typ.: 180-300°C.
• Heat-up time: approx. 15 min.
• Full colour 3,8”TFT touch screen.
• Dynamic warming-up control ensuring stable temperatures and virtually no overshoot.
• USB and Ethernet ports for direct printing or external storage and remote service.
• Profiling software for temperature data recording.
• Graphic display mode for viewing temperature on a time base.
• 3 pre-heat and 1 reflow zone.
• Up to 300ºC for lead free soldering.
• Solder fume extraction fan.
• Bottom cooling fans at offload section.
• 365mm soldering width.
• Clearance for assemblies up to 25 mm (1 inch.)
• Length process chamber: 1400 mm (55 inch.)
• Dimensions: 2260 x 860 x 360 mm.( L x W x H)
• Net weight: 160 kg
• Option: Cabinet